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JSSST International Conference Series
Camera-Ready Submission Details |
1st International Conference on
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Accepted papers and invited papers will be published in the AMCP'98 proceedings, which will be distributed during the conference. Springer-Verlag has also agreed to publish the revised proceedings after the conference as a volume in the Lecture Notes in Computer Science (LNCS) series.
Each paper is allocated the maximum pages in the format specified by
Springer-Verlag (http://www.springer.de/). For the invited papers, the maximum page length is 20 pages. And for the accepted technical papers, maximum page length is 16 pages. Formatting instructions, including templates in MS Word and Latex are available from Springer-Verlag Author Instructions in the LNCS home page (http://www.springer.de/comp/lncs/index.html). Authors of technical papers may purchase up to four additional pages at the cost of US $50 per page. There will be additional charges of US $300 for any pages printed in color (If you choose to have any pages reproduced in color, please enclose a note specifying which ones.) Please note that all additional charges are payable to AMCP'98, c/o Shojiro Nishio and not to Springer.Maximum length:
Each paper include:
Authors need to submit the following items by
October 9, 1998: Prof. Yoshifumi KITAMURA
Department of Electronics and Information Systems
Graduate School of Engineering
Osaka University (Room: E6-618)
2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
Phone: +81-6-879-7752
If you are Japanese, please use Japanese notation:
〒565-0871 吹田市山田丘 2-1
大阪大学大学院工学研究科
aries.ise.eng.osaka-u.ac.jp
log in as
Please follow the naming convention of the first author's name as the file name, and please use the surname and initial of the first author's given name. For instance, Yoshifumi Kitamura's paper would be named <kitamuray.tar>.
Papers received after the deadline would not be included in the conference proceedings. More information about details on paper camera-ready submissions, please send an e-mail to amcp98-sec@ise.eng.osaka-u.ac.jp.